SMD0603貼片自恢復保險絲

Model	Marking	V _max (V dc)	I_max (A)	I _hold @25°C (A)	I _trip @25°C (A)	P_d Typ. (W)	Maximum Time To Trip		Resistance
							Current (A)	Time (Sec)	R i _min (W)	R1max (W)
SMD0603-001SF	X	60	20	0.01	0.03	0.5	0.2	1.00	15.000	100.000
SMD0603-002SF	Y	60	20	0.02	0.06	0.5	0.2	1.00	12.000	70.000
SMD0603-002SF9v	Y	9	20	0.02	0.06	0.5	0.2	1.00	12.000	70.000
SMD0603-003SF	Z	30	20	0.03	0.09	0.5	0.2	1.00	6.000	50.000
SMD0603-003SF9v	Z	9	20	0.03	0.09	0.5	0.2	1.00	6.000	50.000
SMD0603-004SF	-	24.0	20	0.04	0.12	0.5	0.20	1.00	4.000	40.000
SMD0603-005SF	-	15.0	20	0.05	0.15	0.5	0.25	1.00	3.800	30.000
SMD0603-005SF9v	-	9.0	20	0.05	0.15	0.5	0.25	1.00	3.800	30.000
SMD0603-010SF	1	15.0	35	0.10	0.30	0.5	0.5	1.00	0.900	6.000
SMD0603-010SF9v	1	9.0	35	0.10	0.30	0.5	0.5	1.00	0.900	6.000
SMD0603-020SF	2	9.0	35	0.20	0.50	0.5	1.0	0.60	0.550	3.500
SMD0603-020SF16v	2	16.0	35	0.20	0.50	0.5	1.0	0.60	0.550	3.500
SMD0603-025SF	2	9.0	35	0.25	0.55	0.5	8.0	0.08	0.500	3.000
SMD0603-025SF16v	2	16.0	35	0.25	0.55	0.5	8.0	0.08	0.500	3.000
SMD0603-035SF	3	6.0	35	0.35	0.75	0.5	8.0	0.10	0.200	1.000
SMD0603-040SF	5	6.0	35	0.40	0.80	0.5	8.0	0.10	0.150	0.900
SMD0603-050SF	5	6.0	35	0.50	1.00	0.5	8.0	0.10	0.100	0.800
SMD0603-050SF12v	5	12.0	35	0.50	1.00	0.5	8.0	0.10	0.100	0.800
SMD0603-060SF	7	6.0	35	0.60	1.20	0.5	8.0	0.10	0.080	0.600
SMD0603-065SF	7	6.0	35	0.65	1.30	0.5	8.0	0.10	0.070	0.550
SMD0603-075SF	7	6.0	35	0.75	1.40	0.5	8.0	0.10	0.060	0.450
SMD0603-075SF12	7	12.0	35	0.75	1.40	0.5	8.0	0.10	0.060	0.450
SMD0603-100SF	0	6.0	35	1.00	2.00	0.5	8.0	0.10	0.050	0.300

V max = Maximum operating voltage device can withstand without damage at rated current (Imax).

I max = Maximum fault current device can withstand without damage at rated voltage (V max).

I hold = Hold Current. Maximum current device will not trip in 25°C still air.

I trip = Trip Current. Minimum current at which the device will always trip in 25°C still air.

Pd = Power dissipation when device is in the tripped state in 25°C still air environment at rated voltage.

Ri min/max = Minimum/Maximum device resistance prior to tripping at 25°C.

R1max = Maximum device resistance is measured one hour post reflow.

CAUTION : Operation beyond the specified ratings may result in damage and possible arcing and flame.

Environmental Specifications

Test	Conditions	Resistance change
Passive aging	+85°C, 1000 hrs.	±5% typical
Humidity aging	+85°C, 85% R.H. , 168 hours	±5% typical
Thermal shock	+85°C to -40°C, 20 times	±33% typical
Resistance to solvent	MIL-STD-202,Method 215	No change
Vibration	MIL-STD-202,Method 201	No change
Ambient operating conditions : - 40 °C to +85 °C
Maximum surface temperature of the device in the tripped state is 125 °C

Thermal Derading Chart

Recommended Hold Current(A) at Ambient Temperature(°C)

Model	Ambient Operation Temperature
Model	-40°C	-20°C	0°C	25°C	40°C	50°C	60°C	70°C	85°C
SMD0603-001SF	0.016	0.014	0.012	0.010	0.008	0.007	0.006	0.005	0.0035
SMD0603-002SF	0.031	0.027	0.024	0.020	0.016	0.014	0.012	0.011	0.007
SMD0603-003SF	0.047	0.041	0.036	0.030	0.024	0.021	0.018	0.016	0.0108
SMD0603-004SF	0.052	0.048	0.044	0.040	0.032	0.028	0.024	0.020	0.012
SMD0603-005SF	0.065	0.060	0.055	0.050	0.040	0.035	0.031	0.025	0.015
SMD0603-010SF	0.13	0.12	0.11	0.10	0.08	0.07	0.06	0.05	0.03
SMD0603-020SF	0.27	0.25	0.23	0.20	0.17	0.14	0.12	0.10	0.07
SMD0603-025SF	0.32	0.29	0.27	0.25	0.21	0.18	0.16	0.14	0.10
SMD0603-035SF	0.47	0.41	0.38	0.35	0.29	0.26	0.24	0.20	0.14
SMD0603-040SF	0.54	0.47	0.43	0.40	0.33	0.29	0.27	0.22	0.16
SMD0603-050SF	0.67	0.59	0.54	0.50	0.41	0.37	0.34	0.29	0.20
SMD0603-060SF	0.81	0.70	0.651	0.60	0.49	0.44	0.41	0.34	0.24
SMD0603-065SF	0.87	0.76	0.71	0.65	0.54	0.48	0.44	0.37	0.26
SMD0603-075SF	0.98	0.85	0.81	0.75	0.60	0.54	0.44	0.40	0.31
SMD0603-100SF	1.19	1.13	1.08	1.00	0.80	0.72	0.59	0.54	0.43

Thermal Derating Curve

Average Time-Current Curve

Soldering Parameters

Profile Feature	Pb-Free Assembly
Average Ramp-Up Rate(Ts max to T p)	3℃/second mac.
Preheat -Temperature Min(Ts min) -Temperature Max(Ts max) -Time(Ts min to Ts max)	150℃ 200℃ 60~180 seconds
Time maintained above: -Temperature(TL) -Time(tL)	217℃ 60~150 seconds
Peak Temperature(Tp)	260℃
Ramp-Down Rate	6℃/second max.
Time 25℃ to Peak Temperature	8 minutes max
Storage Condition	0℃~30℃,30%-60%RH

Recommended reflow methods: IR, vapor phase oven, hot air oven, N2 environment for lead-free

Recommended maximum paste thickness is 0.25mm

Devices can be cleaned using standard industry methods and solvents.

Note 1:All temperature refer to topside of the package, measured on the package body surface.

Note 2: If reflow temperatures exceed the recommended profile, devices may not meet the performance requirements

Physical Dimensions(mm.)

型號	A		B		C			D	E
	Min.	Max.		Min.		Max.	Min.			Max.	Min.	Min.
SMD0603-001SF	1.45	1.85		0.65		1.05	0.40			1.00	0.15	0.10
SMD0603-002SF9v	1.45	1.85		0.65		1.05	0.40			1.00	0.15	0.10
SMD0603-002SF	1.45	1.85		0.65		1.05	0.40			1.00	0.15	0.10
SMD0603-003SF9v	1.45	1.85		0.65		1.05	0.40			1.00	0.15	0.10
SMD0603-003SF	1.45	1.85		0.65		1.05	0.40			1.00	0.15	0.10
SMD0603-004SF	1.45	1.85		0.65		1.05	0.40			1.00	0.15	0.10
SMD0603-005SF9v	1.45	1.85		0.65		1.05	0.40			1.00	0.15	0.10
SMD0603-005SF	1.45	1.85		0.65		1.05	0.40			1.00	0.15	0.10
SMD0603-010SF9v	1.45	1.85		0.65		1.05	0.40			1.00	0.15	0.10
SMD0603-010SF	1.45	1.85		0.65		1.05	0.40			1.00	0.15	0.10
SMD0603-020SF	1.45	1.85		0.65		1.05	0.40			1.00	0.15	0.10
SMD0603-020SF16v	1.45	1.85		0.65		1.05	0.40			1.00	0.15	0.10
SMD0603-025SF	1.45	1.85		0.65		1.05	0.40			1.00	0.15	0.10
SMD0603-025SF16v	1.45	1.85		0.65		1.05	0.40			1.00	0.15	0.10
SMD0603-035SF	1.45	1.85		0.65		1.05	0.35			0.90	0.15	0.10
SMD0603-040SF	1.45	1.85		0.65		1.05	0.40			0.90	0.15	0.10
SMD0603-050SF	1.45	1.85		0.65		1.05	0.55			1.15	0.15	0.10
SMD0603-050SF12v	1.45	1.85		0.65		1.05	0.55			1.15	0.15	0.10
SMD0603-060SF	1.45	1.85		0.65		1.05	0.55			1.15	0.15	0.10
SMD0603-065SF	1.45	1.85		0.65		1.05	0.55			1.15	0.15	0.10
SMD0603-075SF	1.45	1.85		0.65		1.05	0.55			1.15	0.15	0.10
SMD0603-075SF12V	1.45	1.85		0.65		1.05	0.55			1.15	0.15	0.10
SMD0603-100SF	1.45	1.85		0.65		1.05	0.55			1.15	0.15	0.10

Termination Pad Characteristics

Terminal pad materials：Tin-plated Nickel-Copper

Terminal pad solder ability：Meets EIA specification RS186-9E and ANSI/J-STD-002 Category 3.

Recommended Pad Layout (mm.)

Tape & reel packaging per EIA481-1

Tape And Reel Specifications (mm)

Governing Specifications		EIA 481-1
W		8.0 ± 0.2
P₀		4.0 ± 0.10
P₁		4.0 ± 0.10
P₂		2.0 ± 0.05
A₀		1.05 ± 0.10
B₀		1.85 ± 0.10
D₀		1.55 + 0.05
F		3.5 ± 0.05
E₁		1.75 ± 0.10
E₂min.		6.25
T		0.20
T₁max.		0.1
K₀		0.75/0.95 ± 0.1
Leader min.		390
Trailer min.		160
卷軸規格
A max.		178
N min.		60
W₁		9.0 ± 0.5
W₂		12.0 ± 0.05
W		8.0 ± 0.2

Storage And Handling
? Storage conditions：30°C max, 30%-60% R.H.
? Devices may not meet specified performance
if storage conditions are exceeded.

Part Number System

SMD 0603 - 口口口 S F 口口V
special voltage Rating(Optional)

Lead-Free

Tin-plated Nickel-Copper

Holding Current Rating

Device Dimensions: Length/width(Unit:1/100 inch) Size1608mm / 0603 inch

Surface Mount Device

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